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  1 - 2 ? 2000 ixys all rights reserved symbol test conditions maximum ratings v dss t j = 25  c to 150  c 250 v v dgr t j = 25  c to 150  c; r gs = 1 m  250 v v gs continuous  20 v v gsm transient  30 v i d25 t c = 25  c 100 a i dm t c = 25  c, pulse width limited by t jm 400 a i ar t c = 25  c 100 a e ar t c = 25  c64mj e as t c = 25  c3j dv/dt i s  i dm , di/dt  100 a/  s, v dd  v dss 5 v/ns t j  150  c, r g = 2  p d t c = 25  c 600 w t j -55 ... +150  c t jm 150  c t stg -55 ... +150  c t l 1.6 mm (0.063 in.) from case for 10 s -  c v isol 50/60 hz, rms t = 1 min 2500 v~ i isol  1 ma t = 1 s 3000 v~ m d mounting torque 1.5/13 nm/lb.in. terminal connection torque 1.5/13 nm/lb.in. weight 30 g symbol test conditions characteristic values (t j = 25  c, unless otherwise specified) min. typ. max. v dss v gs = 0 v, i d = 3ma 250 v v gs(th) v ds = v gs , i d = 8ma 2 4 v i gss v gs =  20 v, v ds = 0  200 na i dss v ds = v dss t j = 25  c 100  a v gs = 0 v t j = 125  c2 ma r ds(on) v gs = 10 v, i d = 0.5 ? i d25 27 m  note 1 98625a (6/99) ixfn 100n25 v dss = 250 v i d25 = 100 a r ds(on) = 27 m  t rr  250 ns advanced technical information hiperfet tm power mosfets single mosfet die n-channel enhancement mode avalanche rated, high dv/dt, low t rr s g s d minibloc, sot-227 b (ixfn) e153432 g = gate d = drain s = source tab = drain either source terminal at minibloc can be used as main or kelvin source features  international standard package  minibloc, with aluminium nitride isolation  low r ds (on) hdmos tm process  rugged polysilicon gate cell structure  unclamped inductive switching (uis) rated  low package inductance  fast intrinsic rectifier applications  dc-dc converters  battery chargers  switched-mode and resonant-mode power supplies  dc choppers  temperature and lighting controls advantages  easy to mount  space savings  high power density ixys reserves the right to change limits, test conditions, and dimensions.
2 - 2 ? 2000 ixys all rights reserved symbol test conditions characteristic values (t j = 25  c, unless otherwise specified) min. typ. max. g fs v ds = 10 v; i d = 0.5  i d25 note 1 40 70 s c iss 9100 pf c oss v gs = 0 v, v ds = 25 v, f = 1 mhz 1800 pf c rss 600 pf t d(on) 42 ns t r v gs = 10 v, v ds = 0.5  v dss , i d = 0.5  i d25 55 ns t d(off) r g = 1  (external), 110 ns t f 40 ns q g(on) 300 nc q gs v gs = 10 v, v ds = 0.5  v dss , i d = 0.5  i d25 57 nc q gd 160 nc r thjc 0.22 k/w r thck 0.05 k/w source-drain diode characteristic values (t j = 25  c, unless otherwise specified) symbol test conditions min. typ. max. i s v gs = 0 v 100 a i sm repetitive; 400 a pulse width limited by t jm v sd i f = i s , v gs = 0 v, note 1 1.5 v t rr 250 ns q rm 1.4  c i rm 10 a i f = 50a,-di/dt = 100 a/  s, v r = 100 v note: 1. pulse test, t  300  s, duty cycle d  2 % ixfn 100n25 m4 screws (4x) supplied dim. millimeter inches min. max. min. max. a 31.50 31.88 1.240 1.255 b 7.80 8.20 0.307 0.323 c 4.09 4.29 0.161 0.169 d 4.09 4.29 0.161 0.169 e 4.09 4.29 0.161 0.169 f 14.91 15.11 0.587 0.595 g 30.12 30.30 1.186 1.193 h 38.00 38.23 1.496 1.505 j 11.68 12.22 0.460 0.481 k 8.92 9.60 0.351 0.378 l 0.76 0.84 0.030 0.033 m 12.60 12.85 0.496 0.506 n 25.15 25.42 0.990 1.001 o 1.98 2.13 0.078 0.084 p 4.95 5.97 0.195 0.235 q 26.54 26.90 1.045 1.059 r 3.94 4.42 0.155 0.174 s 4.72 4.85 0.186 0.191 t 24.59 25.07 0.968 0.987 u -0.05 0.1 -0.002 0.004 minibloc, sot-227 b ixys mosfets and igbts are covered by one or more of the following u.s. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025


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